ASSIGNMENT代写

新西兰作业代写 电路板是如何制作

2020-06-06 04:10

要了解电路板是如何制作的,他们首先需要了解焊接。焊接是将焊料熔化成液体以将电子元件绑定到焊接板上。焊料通常由锡和铅制成。最常见的焊料由60%的锡和40%的铅组成。当你焊接烙铁的尖端变热,所以小心不要触摸它。每次用烙铁捆扎东西时,必须清洗烙铁头。这背后的原因是烙铁的尖端氧化,会使金属脏,导致金属不能正确地结合。在这个实验中,焊料将被用来捆绑的Perf板与二极管。实验中使用的特定二极管是LED。led是一种发出非相干单色光的半导体器件。一个LED包含一个充满杂质的半导体芯片,形成PN结。led的颜色取决于材料中形成PN结的带隙能量。在PN结中使用的材料给出了与近红外、可见光或近紫外光相对应的带隙能量。在实验过程中,LED周围会有散热片,以防止它比没有散热片的情况下更快地油炸。用于实验的散热器将是被动散热器。被动散热器没有活动部件,例如风扇。最常见的散热器材料是铝,因为它重量轻,导热性好。有许多不同类型的被动散热器。其中一些是保税散热器,skived散热器和冲压散热器。
新西兰作业代写 电路板是如何制作
To understand how circuit boards are made, their first needs to be a understanding of soldering. Soldering is when solder is melted into a liquid to bind electrical components to a Perf Board. Solder is usually made of tin and lead. The most common solder is made up of sixty percent tin and forty percent lead. When you solder the tip of the soldering iron gets hot, so be careful not to touch it. Each time something is bound with the soldering iron, the tip of the soldering iron must be cleaned. The reason behind this is because the tip of the soldering iron oxidizes and can get the metal dirty causing the metal to not bind properly. The solder in this experiment will be used to bind the Perf Board with the diode. The specific diode that will be used in the experiment is a LED.LEDs are a semiconductor device that emits incoherent monochromatic light. A LED contains a chip of semiconducting impregnated with impurities make a PN junction. The color of the LEDs depends on the amount of bandgap energy in the materials forming the PN junction. The materials used in the PN junction give of this bandgap energy that corresponds to near-infrared, visible or near-ultraviolet light. During the experiment the LED will have a heat sink around it to prevent it from frying faster than it does without one.The heat sinks that will be used for the experiment will be passive heat sinks. Passive heat sinks have no moving parts, for example a fan. The most common material for a heat sink is aluminum because, it is light weight and has good thermal conductivity. There are many different types of passive heat sinks. A few of them are bonded heat sinks, skived heat sink and a stamped heat sink.
 
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